The upward movement of Taiwan Semiconductor Manufacturing Company (TSMC) is primarily driven by strong strategic execution and robust demand in the high-performance computing and artificial intelligence sectors. A major catalyst for the positive investor sentiment is the recently announced ten-year advanced packaging cooperation agreement with Amkor Technology. Under this long-term partnership, TSMC will procure advanced packaging and testing services from Amkor in Arizona, significantly bolstering the domestic semiconductor manufacturing ecosystem in the United States and addressing ongoing supply chain resilience concerns. This move directly supports TSMC’s aggressive expansion plans in the U.S. and provides clear visibility for…