TradingKey – According to a report by South Korean media outlet THE ELEC on Monday, Micron Technology ( MU )’s sixth-generation High Bandwidth Memory, HBM4, production ramp-up is twice as fast as its 12-layer HBM3 products, with yield rates improving simultaneously. Meanwhile, Micron is outsourcing the base die for its next-generation HBM4E to TSMC, with mass production planned for 2027.

Market expectations for Micron have shifted from three months ago, when it was “excluded from NVIDIA’s ( NVDA) supply chain,” to now becoming a “key supplier.” The market’s focus is on whether this reversal can propel Micron’s stock price past $1,000?